Kandou
company
Interconnect
Swiss fabless company. Copenhagen design centre works on Chord signaling-based SerDes and Glasswing USR/XSR die-to-die PHY for chiplet interconnects. TSMC fabrication.
Semiconductor activity in Denmark
Kandou (Swiss HQ, 137-208 employees globally) develops high-speed SerDes IP using patented Chord signaling technology. The Copenhagen design centre contributes analog and digital design engineers to the Glasswing USR/XSR die-to-die PHY IP for chiplet interconnects. Products are fabricated at TSMC and target the rapidly growing chiplet ecosystem.
Key facts
- Swiss HQ, 137-208 employees globally
- Copenhagen is one of several EU design centres
- Patented Chord signaling technology
- TSMC fabrication
Technology focus
- Chord signaling SerDes IP
- Glasswing USR/XSR die-to-die PHY
- Chiplet interconnect technology
- TSMC process nodes
R&D footprint
~15
estimated R&D staff in Denmark — Denmark design centre, Copenhagen